| 摘要 |
PROBLEM TO BE SOLVED: To provide: a circuit board which enables the increase in the peel strength of a thermoplastic liquid crystal polymer film (hereinafter referred to as "liquid crystal polymer film" in some cases) and a copper foil, and which is superior in heat resistance; and a method for manufacturing such a circuit board.SOLUTION: A circuit board comprises at least a copper foil 14, and a thermoplastic liquid crystal polymer film 16. The thermoplastic liquid crystal polymer film 16 is thermocompression-bonded on at least one copper foil plane. A copper foil surface provided on the copper foil plane has many island portions 15 and groove portions 13 arranged to surround the island portions 15, and extending toward a bottom of the copper foil. As for no less than 80% of the island portions 15, each island portion has a non-needle-like leading end shape. The groove portions 13 have an average depth of 0.5-3 μm. |
