THERMALLY CONDUCTIVE DEFORMABLE AGGREGATE, THERMALLY CONDUCTIVE RESIN COMPOSITION, THERMALLY CONDUCTIVE MEMBER, AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a thermally conductive member having high thermal conductivity and excellent film-formability and substrate followability, and a thermally conductive resin composition for producing an adhesive sheet excellent in heat resistance.SOLUTION: An easily deformable aggregate (D) contains 100 pts.wt of thermally conductive particles (A) having an average primary particle size of 0.1-10 μm, and 0.1-30 pts.wt of an organic binder (B) having a reactive functional group; and has an average particle size of 2-100 μm, and an average compressive force required for a compression deformation rate of 10% of 5 mN or less.