发明名称 THIN FILM FORMATION METHOD, AND THIN FILM FORMATION DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a thin film formation method in which unevenness is hardly caused on a thin film surface.SOLUTION: A roof-like damming structure is formed along an edge of a scheduled area where a thin film pattern is to be formed, on a substrate surface. After forming the damming structure, droplets of a liquid photocurable thin film material are landed on the scheduled area, then the thin film material landed on the scheduled area is irradiated with temporary curing light to be temporarily cured, thereby a film element is formed. The film element is coated with the liquid photocurable thin film material so that a liquid film is formed. The liquid film and the film element are irradiated with final curing light with optical intensity larger than the temporary curing light, thereby the liquid film is cured and the film element is enhanced in a degree of cure.</p>
申请公布号 JP2015009193(A) 申请公布日期 2015.01.19
申请号 JP20130136145 申请日期 2013.06.28
申请人 SUMITOMO HEAVY IND LTD;MEIKO ELECTRONICS CO LTD 发明人 OKAMOTO YUJI;KUROSU MITSUHO
分类号 B05D5/06;B05C5/00;B05C9/06;B05C9/10;B05C9/12;B05D1/26;B05D3/00;B05D7/24;H05K3/28 主分类号 B05D5/06
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