发明名称 |
ELECTRIC CIRCUIT BOARD WITH THROUGH-HOLE ELECTRODE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an inexpensive electric circuit board with through-hole electrodes while forming fine through-hole electrodes having excellent strength.SOLUTION: The electric circuit board with through-hole electrodes includes an electrode formed inside a through-hole by a vacuum impregnation method when the through-hole electrode is formed in a substrate before an electric circuit is formed at a first surface 07 and a second surface 08 where no electric circuit is formed.</p> |
申请公布号 |
JP2015012285(A) |
申请公布日期 |
2015.01.19 |
申请号 |
JP20130148893 |
申请日期 |
2013.07.01 |
申请人 |
MM CO LTD |
发明人 |
SAKUMA MASAO;KOMURO YOSHINORI |
分类号 |
H01L21/3205;H01L21/768;H01L23/14;H01L23/15;H01L23/32;H01L23/522 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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