发明名称 LAMINATE FOR SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR LIGHT-EMITTING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a laminate for a semiconductor light-emitting device capable of improving long-term stability of the semiconductor light-emitting device and of further enhancing the light emission intensity, and to provide a method of manufacturing the same, and a semiconductor light-emitting device.SOLUTION: A laminate (10) for a semiconductor light-emitting device comprises: a base material main body (11) on whose surface an uneven structure layer (12) configured by a plurality of convex parts (12a) and concave parts (12b) connecting therebetween is provided; and a planarizing layer (13) provided on the unevenness structure layer (12) so as to cover the plurality of convex parts (12a) and the concave parts (12b). A surface of the planarizing layer (13) has a surface roughness Ra of 10 nm or less, and has a surface waviness Wa of 10 nm or more and 10,000 nm or less. By providing a light-emission part on the planarizing layer (13), the semiconductor light-emitting device is manufactured.</p>
申请公布号 JP2015011760(A) 申请公布日期 2015.01.19
申请号 JP20130133734 申请日期 2013.06.26
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 NAKADA TAKUTO
分类号 H05B33/02;H01L51/50;H05B33/10;H05B33/22 主分类号 H05B33/02
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