| 摘要 |
<p>The present invention relates to a dicing die bonding film and a manufacturing method thereof. A burr free dicing die bonding film for a semiconductor according to an embodiment of the present invention comprises: a base film layer; a cross-linkable resin layer formed on an upper side of the base film layer; an adhesive layer formed on an upper side of the cross-linkable resin layer; and a bonding layer formed on an upper side of the adhesive layer. The cross-linkable resin layer is a thermosetting polymer resin of urethane ingredients, has a glass transition temperature of -10 to 25°C, a gel fraction of 70-100% and a thickness of 10-70 micrometers. Accordingly, the present invention prevents the generation of cutting scraps of a base film in a dicing process and is able to improve die pick-up performance.</p> |
