| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: A semiconductor device PK1 in one embodiment has a clip CLP, a first conductive material, mounted over a semiconductor chip CHP and a lead LD1. The clip CLP includes a plate-like portion PLT and support portions SU1 and SU2 which are formed integrally with the plate-like portion PLT. An end of the support portion SU1 is exposed from a sealing body MR, and a bent portion BD1 is formed in the support portion SU1. Similarly, an end of the support portion SU2 is exposed from the sealing body MR, and a bend portion BD2 is formed in the support portion SU2. |
