| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition high in heat resistance and lightfastness and excellent in thixotropy and handling ability.SOLUTION: Since a polysiloxane composition consisting of a polysiloxane based compound, an inorganic filler, a polyfunctional acrylate and/or a polyfunctional methacrylate, and a hydrosilylation catalyst can control viscosity and thixotropy, handling ability when sealing an optical semiconductor element is excellent and a molding high in heat resistance, lightfastness and transparency is obtained after curing. |
