发明名称 POLISHING DEVICE, METHOD FOR ARRANGING POLISHING PAD AND POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide a polishing device where a polishing pad is arranged by easily positioning to a polishing table and an air reservoir is hard to be generated when the polishing pad is pasted on the polishing table.SOLUTION: A polishing pad 108 whose pasting surface is an underside is arranged and pasted on a polishing table 110 while a position guide member 130 is inserted into a guide hole 109. At this time, the guide hole 109 of the polishing pad 108 is guided by the position guide member 130 and the polishing pad 108 is easily positioned so that the upper surface of the polishing table 110 coincides with an outer periphery. A portion where release paper is removed is pasted on the polishing table 110 while the release paper is removed little by little from the rear surface of the polishing pad 108.
申请公布号 JP2015009340(A) 申请公布日期 2015.01.19
申请号 JP20130138033 申请日期 2013.07.01
申请人 EBARA CORP 发明人 HAMAURA KAORU;SAKURAI TAKESHI;OGURA MASARU
分类号 B24B37/11;H01L21/304 主分类号 B24B37/11
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