| 摘要 |
PROBLEM TO BE SOLVED: To fill the gap between the underside of an electronic component and one surface of a substrate appropriately with a mold resin, in a configuration where upper and lower sides of the electronic component mounted on a substrate are sealed with the mold resin.SOLUTION: A mold package includes a substrate 10, an electronic component 20 having an element 21 separated from one surface 11 of the substrate 10 and a component electrode 22 integrated with the element 21 and connected with one surface 11 of the substrate 10, and a mold resin 30 for sealing one surface 11 of the substrate 10 along with the electronic component 20. The mold resin 30 fills the gap between the lower surface 21a of the element 21 and one surface 11 of the substrate 10, and covers the upper surface 21b of the element 21. Around the electronic component 20, a frame 14 projecting above one surface 11 of the substrate 10 is provided, and the side face of the frame 14 on the electronic component 20 side is an inclined plane 14a approaching the electronic component 20 from above one surface 11 of the substrate 10 toward the one surface 11. |
