| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package having a wire bond wall to reduce coupling.SOLUTION: A package 20 includes a substrate 74, and a first circuit 22 on the substrate. The first circuit includes a first electrical device 102, a second electrical device 100, 104, and a first wire bond array 112 interconnecting the first electrical device and the second electrical device. The package includes a second circuit 24 on the substrate adjacent to the first circuit, and the second circuit includes a second wire bond array 114 interconnecting a third electrical device 108 and a fourth electrical device 106, 110. The package includes a wire bond wall 50 including a plurality of wire bonds over the substrate between the first circuit and the second circuit. The wire bond wall is configured to reduce electromagnetic coupling between the first circuit and the second circuit during an operation of at least one of the first circuit and the second circuit. |
