| 摘要 |
<p>The present invention relates to a thermosetting adhesive composition and a coverlay film using the same. The thermosetting adhesive composition of the present invention comprises non-halogen based epoxy resin, acryl rubber containing a carboxyl group, polyester resin containing a carboxyl group, multifunctional curing agents for epoxy resin, phosphate based flame retardants and fluorine based compounds at optimal proportion, prevents harmful gas from being generated in combustion since halogen is not contained, is capable of being applied to a bonding sheet for multi-layered PCB manufacture, coverlay film, a flexible copper clad laminate (FCCL) having a conductive pattern by improving low permittivity and migration resistance when being applied to an insulation layer on an electroconductive material, is capable of increasing electrical reliability when being applied to an electronic product and is easy to be applied a small-sized electronic product.</p> |
