电子．电气机器用铜合金、电子．电气机器用铜合金薄板、电子．电气机器用导电构件及端子;COPPER ALLOY FOR ELECTRONIC/ELECTRIC DEVICE, COPPER ALLOY THIN PLATE FOR ELECTRONIC/ELECTRIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRONIC/ELECTRIC DEVICE, AND TERMINAL

摘要

此电子电气机器用铜合金之一态样，含有：超过2.0mass%、36.5mass%以下之Zn；0.10mass%以上、0.90mass%以下之Sn；0.15mass%以上、1.00mass%未满之Ni；以及0.005mass%以上、0.100mass%以下之P；其余部分由Cu及不可避免的杂质所成；元素含有量之原子比满足3.0<Ni/P<100.0、及0.10<Sn/Ni<2.90；含有Cu、Zn及Sn之α相的表面之维氏硬度为100以上。; Sn: 0.10 mass% or more to 0.90 mass% or less; Ni: 0.15 mass% or more to less than 1.00 mass%; P: 0.005 mass% or more to 0.100 mass% or less; and the balance of Cu and inevitable impurities, wherein atomic ratios of elemental contents fulfill 3.0 < Ni/P < 100.0 and 0.10 < Sn/Ni < 2.90, and a Vickers hardness of a surface of an α