| 摘要 |
<p>The present invention provides a break device for a bonded substrate, wherein an overall scribe line can be effectively broken without undoing a mother plate. To solve the problem, on both surfaces of the bonded substrate (M) consisting of a first substrate (1) and a second substrate (2), scribe lines for division are formed so that the break device (D) can break the bonded substrate (M) along the corresponding scribe line. The break device comprises: a returning tool (3) for returning the bonded substrate (M); a break bar (4) for pressing the substrate (M) from the top surface of the first substrate (1); and an accommodating member (5) disposed at the bottom of the break bar (4) by inserting the substrate (M) and receiving the bottom surface of the substrate (M). The break bar (4) is pressed on the first substrate (1) along the scribe line for division formed on the first substrate (1), and the second substrate (2) is simultaneously received by the accommodating member (5). Accordingly, the scribe line for division of the second substrate is broken, and the scribe line for division of the first substrate (1) formed in the right rear of the corresponding scribe line is also simultaneously broken.</p> |
