发明名称 |
TEMPORARY ADHESIVE FOR SEMICONDUCTOR DEVICE PRODUCTION, ADHESIVE SUPPORTING BODY USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING SAME |
摘要 |
The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive layer formed from the temporary adhesive for production of semiconductor device, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive for production of semiconductor device as claimed; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer. |
申请公布号 |
KR20150006480(A) |
申请公布日期 |
2015.01.16 |
申请号 |
KR20147034543 |
申请日期 |
2013.05.30 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
FUJIMAKI KAZUHIRO;KOYAMA ICHIRO;NAKAMURA ATSUSHI;IWAI YU;TAN SHIRO |
分类号 |
C09J201/02;C09J11/06;C09J133/00;C09J161/06;C09J175/04 |
主分类号 |
C09J201/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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