| 摘要 |
The invention relates to a method for producing a structure on a supporting substrate (12), said structure including at least one electric circuit component. The method comprises at least one deposition of a component layer (11a, 9a; 11b, 9b; 11e, 9c, 7) on the supporting substrate (12), each component layer deposition consisting in: applying a component layer on the supporting substrate (12) using a transfer substrate (1); subsequently, securely fixing the component layer to the supporting substrate (12); and, finally, separating the transfer substrate (1) and the component layer. Thus, the method according to the invention can be used to: produce a component layer by means of photolithography on a rigid silicon substrate; subsequently, transfer same onto a flexible supporting substrate (12); and/or check the condition of the component layer before transferring same onto the supporting substrate. Moreover, the method of the invention can be used to produce a thin structure. |
