发明名称 BONDING PANEL AND PANEL BONDING METHOD THEREOF
摘要 <p>Disclosed are a sandwich panel that improves bonding strength between panels of composite materials to be bonded, and a bonding method thereof. The sandwich panel includes a first panel made of a composite material; a second panel made of aluminum or steel material and layered below the first panel; an adhesive layer formed by applying an adhesive on the top surface of the second panel so that the first and second panels are pressed by upper and lower molds; and a resin layer having an upper portion penetrating the second panel and the adhesive layer and adhered to the bottom surface of the first panel in a state in which the first and second panels are layered, with the adhesive layer being interposed therebetween, and a lower portion covering a given area of the second panel.</p>
申请公布号 KR101483226(B1) 申请公布日期 2015.01.16
申请号 KR20130109073 申请日期 2013.09.11
申请人 SUNG WOO HITECH CO., LTD. 发明人 LEE, YOUNG JU;LEE, MUN YONG
分类号 B23K20/12 主分类号 B23K20/12
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