发明名称 Agente de curado para resina epoxi que es producto de reaccion entre metaxililendiamina o paraxililendiamina y u7n acido carboxilico insaturado; composición de resina epoxi y adhesivo para barrera de gas y laminado con barrera de gas.
摘要 Provided is e.g., an epoxy resin curing agent, epoxy resin composition and a gas-barrier adhesive containing the epoxy resin composition which can express high gas-barrier properties and excellent adhesiveness to various types of plastics, in particular, to polyester, and a gas-barrier laminate having high gas-barrier properties and excellent adhesiveness to various types of plastics, in particular, to polyester. The epoxy resin curing agent of the present invention is a reaction product of the following (A) and (B). Furthermore, the epoxy resin curing agent of the present invention contains at least an epoxy resin and the epoxy resin curing agent of the present invention. (A) metaxylylenediamine or paraxylylenediamine; (B) an unsaturated carboxylic acid represented by the following formula (1) and/or derivatives thereof: wherein R 1 represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms or an aryl group.
申请公布号 CL2014002849(A1) 申请公布日期 2015.01.16
申请号 CL20140002849 申请日期 2014.10.22
申请人 HENKEL AG & CO. KGAA;MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 HONDA EIICHI;KOUNO KAZUKI
分类号 B32B15/08;C07C233/38;C08G59/44;C09J163/00 主分类号 B32B15/08
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