发明名称 具有可挠部之刚性印刷配线基板之弯回方法;METHOD OF BENDING BACK RIGID PRINTED WIRING BOARD WITH FLEXIBLE PORTION
摘要 本发明之具有可挠部之刚性印刷配线基板之弯回方法系包含:准备步骤,其系形成准备基板,该准备基板于包含热硬化性树脂之预浸材料之表面,配设有包含导电材料之导电层;积层步骤,其系重叠复数片上述准备基板;热硬化步骤,其系对于该积层步骤重叠之复数片上述准备基板,一面加热一面将彼此按压对准,且使上述热硬化性树脂热硬化,并作为中间基板而一体化;切削步骤,其系沿上述准备基板之积层方向切削该热硬化步骤中热硬化性树脂热硬化而形成之绝缘层,且形成遍及上述中间基板之对向之两边之间形成之很薄之可挠部,而作为完成基板;弯曲步骤,其系使上述可挠部弯曲;及弯回步骤,其系使于该弯曲步骤中弯曲之上述可挠部弯回;且于上述弯回步骤前,进行使上述弯曲之状态之上述可挠部升温之脱水步骤。; a laminating step of laminating the plurality of preparation substrates; a thermally hardening step of thermally hardening the thermosetting resin so as to integrate the plurality of preparation substrates laminated at the laminating step as an intermediate substrate while heating and pressing the plurality of preparation substrates one another; a cutting step of cutting an insulating layer formed by thermal hardening the thermosetting resin at the thermally hardening step in a lamination direction of the preparation substrate so as to form a flexible portion, the flexible portion being thinly formed across opposed both edges of the intermediate substrate to form a complete substrate; a bending step of bending the flexible portion; a bending-back step of bending-back the flexible portion bent at the bending step; and a dehydrating step of dehydrating by raising a temperature of the bent flexible portion before the bending-back step.
申请公布号 TW201503783 申请公布日期 2015.01.16
申请号 TW103126809 申请日期 2014.08.05
申请人 名幸电子股份有限公司 发明人 户田光昭;志志目和男;吉水久典
分类号 H05K3/00(2006.01) 主分类号 H05K3/00(2006.01)
代理机构 代理人 陈长文
主权项
地址 日本