| 摘要 |
<p>Provided is a light emitting device package to improve stability and durability. A light emitting device package according to an embodiment includes: a first lead frame and a second lead frame; a silicon oxide layer which is arranged on the surface of at least part of the first lead frame and the second lead frame; a substrate which is combined with the first lead frame and the second lead frame between which the silicon oxide layer is interposed; a light emitting device which electrically touches the first lead frame and the second lead frame; and a molding part which surrounds the light emitting device.</p> |
