| 摘要 |
本发明揭示一种影像感测器装置之方法及结构，该影像感测器装置包括一读出积体电路(ROIC)及一光二极体阵列(PDA)。一实施例可包括具有一凹口及该凹口内之一凸起基座之一封装基板；一读出积体电路(ROIC)，其实体上附接至该凸起基座；一光二极体阵列(PDA)，其实体上附接至该ROIC且与其电耦合；及一印刷电路板(PCB)，其在该封装基板中之该凹口内，其中该PCB在其中具有一开口且该凸起基座至少部分延伸穿过该PCB中之该开口。; a read out integrated circuit (ROIC) physically attached to the raised pedestal; a photodiode array (PDA) physically attached to the ROIC and electrically coupled therewith; and a printed circuit board (PCB) within the recess in the package substrate, wherein the PCB has an opening therein and the raised pedestal at least partially extends through the opening in the PCB. |
