| 摘要 |
<p>A polishing method capable of preventing damage to a substrate in advance is disclosed. The polishing method according to the present invention includes: inspecting a periphery of a substrate for an abnormal portion, polishing the substrate if the abnormal portion is not detected, and not polishing the substrate if the abnormal portion is detected. The abnormal portion of the substrate may be a foreign matter, such as an adhesive, attached to the periphery of the substrate. After polishing of the substrate, the periphery of the substrate may be inspected again for an abnormal portion.</p> |
