| 摘要 |
A semiconductor device capable of improving a quality and a productivity of a product is provided. Second and third pads are disposed adjacent to each other on the substrate (1). An electrically conductive tape (6) is adhered to the second and third pads. An electrically conductive tape (6) has a through hole (7) at an inner portion of the second pad. An electrically conductive adhesive (8) is coated in the through hole (7). An electrically conductive adhesive (8) has a thermal conductivity higher than the thermal conductivity of the electrically conductive tape (6). A semiconductor chip (9) is mounted on the second pad by the electrically conductive adhesive (8). An electronic component (10) is mounted on the third pad by the electrically conductive tape (10). |
