| 摘要 |
本发明系一种具备绝缘基板(11)、被形成在该绝缘基板(11)一方之面之电路层(12)、与被形成在前述绝缘基板(11)另一方之面之金属层(13)之电源模组用基板(10)，其特征为前述电路层(12)具有被接合在前述绝缘基板(11)之由铝或铝合金所构成之第1铝层(12A)、与被固相扩散接合在该第1铝层(12A)之由铜或铜合金所构成之第1铜层(12B)；前述金属层(13)具有由铝或铝合金所构成之第2铝层(13A)；前述电路层(12)的厚度t1与前述金属层(13)第2铝层(13A)的厚度t2之关系为t1<t2。; a circuit layer (12) formed on a first surface of the insulation substrate (11); and a metal layer (13) formed on a second surface of the insulation substrate (11). The circuit layer (12) has a first aluminum layer (12A) which is formed of aluminum or an aluminum alloy and bonded on the insulation substrate (11), and a first copper layer (12B) which is formed of a copper or a copper alloy and bonded with the first aluminum layer (12A) by solid state diffusing. The metal layer (13) has a second aluminum layer (13A) which is formed of aluminum or an aluminum alloy. The relationship between the thickness t1of the circuit layer (12) and the thickness t2of the second aluminum layer of the metal layer (13) satisfies t1< t2. |
