| 摘要 |
PURPOSE:To realize a high quality low cost production of printed board by making automatic test for mass production of high density printed board pos sible to be carried out. CONSTITUTION:Two sets of surface layer 2, signal layer 3, and dedicated power supply layer 4 are provided and a pattern 10 for boundary scan test control signal is led out and wired, along with a test pattern I/O pattern, from the output terminal of a boundary scan LSI 5. The wiring of the pattern 10 for control signal is partially passed through the dedicated power supply layer 4 by means of a blind via hole. A pattern 11 for output signal is led out and wired from the output terminal of a non-boundary scan LSI 6 and the wiring of pattern for signal is normally made independently using semi-through via holes 8, 9. |
