| 发明名称 |
SOLID-STATE IMAGING APPARATUS, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS |
| 摘要 |
A solid-state imaging apparatus includes a semiconductor substrate in which a charge transfer section configured to transfer a charge generated in a photoelectric conversion section is formed. The semiconductor substrate includes a surface that is formed in a convex shape in an area in which the charge transfer section is formed. |
| 申请公布号 |
US2015014750(A1) |
申请公布日期 |
2015.01.15 |
| 申请号 |
US201414323510 |
申请日期 |
2014.07.03 |
| 申请人 |
Sony Corporation |
发明人 |
Ohchi Tomokazu |
| 分类号 |
H01L27/148;H01L27/146 |
主分类号 |
H01L27/148 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A solid-state imaging apparatus, comprising
a semiconductor substrate in which a charge transfer section configured to transfer a charge generated in a photoelectric conversion section is formed, the semiconductor substrate including a surface that is formed in a convex shape in an area in which the charge transfer section is formed. |
| 地址 |
Tokyo JP |
