| 摘要 |
A substrate examining apparatus for use in examining the shape of a soldered portion of a part mounted on a substrate, and determining the correctness of the shape. For the purpose of illuminating a substrate to be examined, three kinds of ring-shaped light-emitting members are provided, which are adapted to generate red, green and blue beams, respectively, and which are arranged in such positions as to allow these beams to be projected at different incident angles with respect to the surface of the substrate. The three primary color beams emitted from these light-emitting members have such wave-length versus emission energy distributions as to form a white beam when these three primary color beams are combined and the quantities of light of these beams are regulated so that these beams form a white beam. Thus, a three-hue optical image of the surface of the material being examined can be detected. It also becomes possible to detect the peripheral information (part number, polarity, color, code and various kinds of marks) indispensable for a soldered portion examination. The specification of this invention also discloses a method of teaching the mounting position and kind of parts and characteristic quantities of actually mounted parts prior to a substrate examination, a method of setting a region to be examined on the substrate, and a method of displaying the results of the examination, all of which methods are implemented on the substrate examining apparatus. |
