| 发明名称 |
Semiconductor Device Having Three Terminal Miniature Package |
| 摘要 |
A semiconductor device (100) comprises a semiconductor chip (310) attached to the pad (302) of a planar leadframe and connected by bonding wires (411) to two leads (403) of the leadframe. The device further includes a plastic body (130) encapsulating chip and wires, the body shaped as a pentahedron with two sides (101, 102) touching at right angle, opposite body ends formed by parallel planes configured as right-angle triangles. The pad (302) and the two leads (303) are exposed from the plastic surface at one body end in order to be operable as solderable device pins positioned in the corners of the triangle. |
| 申请公布号 |
US2015014832(A1) |
申请公布日期 |
2015.01.15 |
| 申请号 |
US201313939276 |
申请日期 |
2013.07.11 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Javier Reynaldo Corpuz;Koduri Sreenivasan |
| 分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor chip attached to the pad of a planar leadframe and wire-bonded to two leads of the leadframe; a plastic body encapsulating chip and wires, the body shaped as a pentahedron with two sides touching at right angle, opposite body ends formed by parallel planes configured as right-angle triangles; and the pad and the two leads exposed from the plastic surface at one body end to be operable as device pins positioned in the corners of the triangle. |
| 地址 |
Dallas TX US |
