BORON NITRIDE AGGREGATED PARTICLE, COMPOSITION CONTAINING BORON NITRIDE AGGREGATED PARTICLE, AND THREE-DIMENSIONAL INTEGRATED CIRCUIT HAVING LAYER COMPRISING THE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a composition for a three-dimensional integrated circuit, from which an interlayer packed layer excellent in thermal conductivity even in a thickness direction can be formed, by using boron nitride aggregated particles excellent in isotropy of thermal conductivity, disintegration resistance and kneading property with a resin.SOLUTION: The boron nitride aggregated particles comprise aggregation of primary particles of hexagonal boron nitride. The primary particles of the boron nitride aggregated particles have a card-house structure.