WAFER TESTING SYSTEM AND ASSOCIATED METHODS OF USE AND MANUFACTURE

摘要

A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.

主权项

1. A method for establishing contact with a wafer having a bond pad, comprising:
placing an interposer to face a wafer translator, placing the wafer translator to face toward the wafer, the wafer translator having a terminal facing the bond pad of the wafer; sealing a first space between the interposer and the wafer translator using a first seal; and drawing a first vacuum on the first space to contact the bond pad of the wafer with the terminal of the wafer translator.