| 发明名称 |
POST CHEMICAL-MECHANICAL-POLISHING (POST-CMP) CLEANING COMPOSITION COMPRISING A SPECIFIC SULFUR-CONTAINING COMPOUND AND A SUGAR ALCOHOL OR A POLYCARBOXYLIC ACID |
| 摘要 |
A post chemical-mechanical-polishing (post-CMP) cleaning composition comprising: (A) at least one compound comprising at least one thiol (—SH), thioether (—SR1) or thiocarbonyl (>C═S) group, wherein R1 is alkyl, aryl, alkylaryl or arylalkyl, (B) at least one sugar alcohol which contains at least three hydroxyl (—OH) groups and does not comprise any carboxylic acid (—COOH) or carboxylate (—COO—) groups, and (C) an aqueous medium. |
| 申请公布号 |
US2015018261(A1) |
申请公布日期 |
2015.01.15 |
| 申请号 |
US201314376978 |
申请日期 |
2013.01.24 |
| 申请人 |
BASF SE |
发明人 |
Li Yuzhuo;Venkataraman Shyam Sundar;Zhong Mingjie |
| 分类号 |
C11D3/34;C11D11/00;C11D3/20 |
主分类号 |
C11D3/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A post chemical-mechanical-polishing (post-CMP) cleaning composition, comprising:
(A) at least one compound comprising at least one thiol (—SH), thioether (—SR1) or thiocarbonyl (>C═S) group, wherein R1 is alkyl, aryl, alkylaryl or arylalkyl, (B) erythritol, threitol, a stereoisomer thereof, or a mixture thereof, and (C) an aqueous medium. |
| 地址 |
Ludwigshafen DE |
