发明名称 |
METHOD OF MANUFACTURING DEVELOPER CONTAINER, DEVELOPER CONTAINER, DEVELOPING APPARATUS, PROCESS CARTRIDGE, AND IMAGE FORMING APPARATUS |
摘要 |
A method of manufacturing a developer container including a frame configured to define a developer containing portion, a first electrode, and a second electrode arranged on a surface of the frame and having a surface opposed to the first electrode, a developer amount in the developer containing portion being detected based on a capacitance between the first electrode and the second electrode, the method including: holding a conductive resin member constituting the second electrode on a mold configured to mold the frame, a surface of the conductive resin member being in contact with a surface of the mold configured to mold a surface of the frame on a side of the developer containing portion; injecting a resin to be formed into the frame, into the mold on which the conductive resin member is held; and curing the resin to form the frame to which the second electrode is fixed. |
申请公布号 |
US2015016829(A1) |
申请公布日期 |
2015.01.15 |
申请号 |
US201414322091 |
申请日期 |
2014.07.02 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Watanabe Taku;Kato Masahito;Shindo Go;Toda Atsushi;Abe Katsuichi;Ito Motonari;Suzuki Akira;Matsumura Junichi;Matsumaru Naoki |
分类号 |
G03G15/08;H01R43/16 |
主分类号 |
G03G15/08 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a developer container including a frame configured to define a developer containing portion, a first electrode, and a second electrode which is arranged on a surface of the frame and which has a surface opposed to the first electrode, a developer amount in the developer containing portion being detected based on a capacitance between the first electrode and the second electrode, the method comprising:
holding a conductive resin member constituting the second electrode on a mold configured to mold the frame, a surface of the conductive resin member being in contact with a surface of the mold, the surface of the mold being configured to mold a surface of the frame on a side of the developer containing portion; injecting a resin to be formed into the frame, into the mold on which the conductive resin member is held; and curing the resin to form the frame to which the second electrode constituted by the conductive resin member is fixed. |
地址 |
Tokyo JP |