发明名称 METHOD OF MANUFACTURING DEVELOPER CONTAINER, DEVELOPER CONTAINER, DEVELOPING APPARATUS, PROCESS CARTRIDGE, AND IMAGE FORMING APPARATUS
摘要 A method of manufacturing a developer container including a frame configured to define a developer containing portion, a first electrode, and a second electrode arranged on a surface of the frame and having a surface opposed to the first electrode, a developer amount in the developer containing portion being detected based on a capacitance between the first electrode and the second electrode, the method including: holding a conductive resin member constituting the second electrode on a mold configured to mold the frame, a surface of the conductive resin member being in contact with a surface of the mold configured to mold a surface of the frame on a side of the developer containing portion; injecting a resin to be formed into the frame, into the mold on which the conductive resin member is held; and curing the resin to form the frame to which the second electrode is fixed.
申请公布号 US2015016829(A1) 申请公布日期 2015.01.15
申请号 US201414322091 申请日期 2014.07.02
申请人 CANON KABUSHIKI KAISHA 发明人 Watanabe Taku;Kato Masahito;Shindo Go;Toda Atsushi;Abe Katsuichi;Ito Motonari;Suzuki Akira;Matsumura Junichi;Matsumaru Naoki
分类号 G03G15/08;H01R43/16 主分类号 G03G15/08
代理机构 代理人
主权项 1. A method of manufacturing a developer container including a frame configured to define a developer containing portion, a first electrode, and a second electrode which is arranged on a surface of the frame and which has a surface opposed to the first electrode, a developer amount in the developer containing portion being detected based on a capacitance between the first electrode and the second electrode, the method comprising: holding a conductive resin member constituting the second electrode on a mold configured to mold the frame, a surface of the conductive resin member being in contact with a surface of the mold, the surface of the mold being configured to mold a surface of the frame on a side of the developer containing portion; injecting a resin to be formed into the frame, into the mold on which the conductive resin member is held; and curing the resin to form the frame to which the second electrode constituted by the conductive resin member is fixed.
地址 Tokyo JP