| 主权项 |
1. A method of cutting a substrate comprising:
advancing a portion of a saw blade into a kerf in a surface of a substrate at an entry point; advancing said portion of said saw blade through said kerf, substantially without contacting said substrate, to contact said substrate adjacent an exit point where said portion of said saw blade exits said kerf and relatively remote from said entry point; advancing said portion of said saw blade into a vacuum manifold, said vacuum manifold being disposed relatively proximate to said exit point and distal to said entry point; advancing said portion of said saw blade through a cavity within said vacuum manifold, said cavity defined by a generally circular cylindrical internal surface of said vacuum manifold, said cavity having a cavity longitudinal axis disposed in generally parallel spaced relation to an axis of rotation of said saw blade and transverse to a motion of said portion of said saw blade through said cavity, said cavity having a radius normal to said cavity longitudinal axis, said cavity radius being substantially smaller than a radius of said saw blade; withdrawing ambient air through said cavity and through a coupling portion coupled to said cavity, said coupling portion having a coupler longitudinal axis, said coupler longitudinal axis defining a passage angle with said cavity longitudinal axis, said passage angle having a value of between at least about 0° and at most about 20°, whereby said withdrawing ambient air tends to form a vortex in said ambient air and to effectively remove sawing detritus from a region adjacent said exit point. |
