METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device by forming a photoresist film on a pattern used as an alignment mark and the like thinly and preventing the pattern from being exposed from the photoresist film and removed in a processing step, in a case where the processing step is performed on the same film a plurality of times.SOLUTION: Patterns PT1 and PT2 used as alignment marks or the like are configured by linear grooves W1 and W2 for opening a conductive film PS1 formed on a semiconductor substrate SB. Thereby, a photoresist film formed on the conductive film PS1 is prevented from being flowed toward an opening of the conductive film PS1.