| 发明名称 |
Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same |
| 摘要 |
A semiconductor package includes an interposer chip having a frontside, a backside, and a corner area on the backside defined by a first corner edge and a second corner edge of the interposer chip. A die is bonded to the frontside of the interposer chip. At least one dam structure is formed on the corner area of the backside of the interposer chip. The dam structure includes an edge aligned to at least one the first corner edge and the second corner edge of the interposer chip. |
| 申请公布号 |
US2015014844(A1) |
申请公布日期 |
2015.01.15 |
| 申请号 |
US201313938821 |
申请日期 |
2013.07.10 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wu Chih-Wei;Lu Szu Wei;Lin Jing-Cheng |
| 分类号 |
H01L23/498;H01L21/82 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
an interposer chip having a frontside, a backside, and a corner area on the backside defined by a first corner edge and a second corner edge of the interposer chip; a die bonded to the frontside of the interposer chip; and at least one dam structure on the corner area of the backside of the interposer chip; wherein the dam structure comprises an edge aligned to at least one the first corner edge and the second corner edge of the interposer chip. |
| 地址 |
Hsin-Chu TW |
