A plated polymer component is disclosed. The plated polymer component may comprise a polymer substrate having an outer surface, and a metal plating deposited on the outer surface of the polymer substrate. The plated polymer component may further comprise an adhesion promoter at an interface between the polymer substrate and the metal plating.
申请公布号
WO2015006418(A1)
申请公布日期
2015.01.15
申请号
WO2014US45907
申请日期
2014.07.09
申请人
UNITED TECHNOLOGIES CORPORATION
发明人
MIARECKI, MICHAEL, S.;WATSON, CHARLES, R.;ROACH, JAMES, T.