| 摘要 |
The purpose of this invention is to provide a photosensitive thermosetting resin composition that is easy to work with, can be processed with a high degree of accuracy, is highly reliable, e.g. is highly impact-resistant and flexible, and is suitable for an insulating film on a flexible printed circuit board, particularly for a process in which a bending section (flex section) and a mounting section (non-flex section) are formed together. Said photosensitive thermosetting resin composition is characterized by containing the following: (A) a polyimide resin that has an imide ring and a carboxyl group; (B) a resin that has a phenolic hydroxyl group; (C) a photobase generator; and (D) a thermosetting component. |
