| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: In an SOP 1 having a semiconductor chip 11 and a semiconductor chip 21, with respect to wire connection between the chips, an inter-wire distance L between a wire 6a closest to a wire group 7, of a wire group 6, and a wire 7a closest to the wire group 6, of the wire group 7, is set to be larger than any other inter-wire distance in the wire group 6 and in the wire group 7, and thus, an insulation withstanding voltage can be secured. Thereby, the reliability of the SOP 1 can be improved. |
