| 摘要 |
PROBLEM TO BE SOLVED: To provide a housing jig capable of accommodating individualized electronic components in lattice pattern, by producing a resin sheet by using a forming die for inverting the shape of the resin sheet.SOLUTION: A room temperature curable liquid resin 18 is supplied to a forming die 12 having a cavity 13 corresponding to a resin sheet 3. A protrusion 14 corresponding to a lattice-shaped recess 7 of the resin sheet 3 is formed in the cavity 13. The resin 18 is cured in a state of immersing the upper surface 10 of a metal table 2 in the resin 18 filling the cavity 13, thus forming a cured resin 19. Consequently, the metal table 2 and the resin sheet 3 composed of the cured resin 19 are bonded, thus manufacturing a housing jig 1 having lattice-shaped recesses 7. Individualized electronic components can be entirely accommodated in the recesses 7 formed in lattice-shape, by using the forming die 12 and forming the recesses 7 in the resin sheet 3 not in checker pattern but in lattice-shape. |
