| 摘要 |
PROBLEM TO BE SOLVED: To suppress variation in load applied to a semiconductor wafer when the semiconductor wafer is ground.SOLUTION: A method of manufacturing a semiconductor device includes the following steps of: preparing a semiconductor wafer 10 divided into a plurality of first semiconductor chips 12; providing at least one stage of second semiconductor chips 22 in some semiconductor chips among the plurality of first semiconductor chips 12; providing an encapsulating material 32 on the first semiconductor chip 13 where second semiconductor chips 22 are not provided; and grinding one surface opposite from the surface on which the second semiconductor chip 22 and the encapsulating material 32 are provided, of the semiconductor wafer 10. |
