| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor module having a cooling function that can effectively cool down a semiconductor device.SOLUTION: In a state where an upper surface of a heat absorption part 111 of a cooling unit 100 is contacted with a rear face of an N-side electrode 9 of a power semiconductor formation part 14 and a waste-heat part 112 is arranged on a fixing waste-heat part 113, a fixture 12 is arranged on a surface of the N-side electrode 9, and the fixture 12 and the fixing waste-heat part 113 are fixed by screwing with a setscrew 29, and thereby, the N-side electrode 9 and the cooling unit 100 are fixed with each other. When the cooling unit 100 is attached to the N-side electrode 9 by the fixture 12, a lower surface of the fixing waste-heat part 113 and a rear face of a rear face copper foil part 5 in the power semiconductor formation part 14 are positioned so as to be formed on the same plane. |
