| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive resist composition for immersion exposure, capable of further improving a receding contact angle with an immersion liquid in immersion exposure and reducing watermark defects, and to provide a pattern forming method using the composition.SOLUTION: The positive resist composition for immersion exposure comprises: (A) a resin that is decomposed by an action of an acid to increase a solubility in an alkali developing solution; (B) a compound that generates an acid by irradiation with actinic rays or radiation; (C) a resin having at least either one of a fluorine atom and a silicon atom; and (D) a mixture solvent containing at least one solvent selected from the group of solvents expressed by general formulae (S1) to (S3), by 3 to 20 mass% in all solvents. |
