发明名称 SUBSTRATE FOR ELECTRONIC DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE USING THE SAME, METHOD OF MANUFACTURING THE SAME, AND SUBSTRATE FOR ORGANIC LED ELEMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate for an electronic device which provides a long life and high reliability electronic device where wiring exfoliation or deterioration is suppressed, by embedding wiring therein while maintaining surface smoothness.SOLUTION: A substrate 100 for an electronic device including first and second opposite main surfaces and having electrode wiring formed on the first main surface includes a glass substrate 101, an auxiliary wiring pattern 200 formed on the first main surface of the glass substrate 101, and a translucent glass layer 102 formed on the surface of the glass substrate 101 so as to overlie the auxiliary wiring pattern 200. Through holes H exposing the auxiliary wiring pattern 200 are formed in part of the glass layer 102, and the entire auxiliary wiring pattern 200 is sealed in the glass layer 102 except for connecting areas exposed through the through holes H. The glass layer vitrified has a smooth surface, and an overlying functional layer is further formed.</p>
申请公布号 JP2015008159(A) 申请公布日期 2015.01.15
申请号 JP20140185637 申请日期 2014.09.11
申请人 ASAHI GLASS CO LTD 发明人 NAKAMURA NOBUHIRO;AOKI YUMIKO;WADA NAOYA
分类号 H05B33/02;H01L51/50;H05B33/10;H05B33/22;H05B33/26 主分类号 H05B33/02
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