SUBSTRATE PROCESSING SYSTEM, METHOD FOR CONTROLLING SUBSTRATE PROCESSING SYSTEM, AND STORAGE MEDIUM

摘要

Disclosed is a substrate processing system including a substrate processing apparatus that includes a nozzle configured to eject a processing liquid to a substrate. The system includes a jig sensor configured to detect whether a checking jig provided with a liquid receiving unit receiving the processing liquid ejected from the nozzle and configured to check an ejection state of the processing liquid from the nozzle is installed at a predetermined position of the substrate processing apparatus; and a controller configured to control the ejection of the processing liquid from the nozzle. When it is determined that the checking jig is installed at the predetermined position of the substrate processing apparatus based on detection of the jig sensor in a state where the ejection of the processing liquid from the nozzle is prohibited, the controller permits the ejection of the processing liquid from the nozzle.

主权项

1. A substrate processing system including a substrate processing apparatus that includes a nozzle configured to eject a processing liquid to a substrate, the system comprising:
a jig sensor configured to detect whether a checking jig provided with a liquid receiving unit receiving the processing liquid ejected from the nozzle and configured to check an ejection state of the processing liquid from the nozzle is installed at a predetermined position of the substrate processing apparatus; and a controller configured to control the ejection of the processing liquid from the nozzle, wherein when the controller determines that the checking jig is installed at the predetermined position of the substrate processing apparatus based on detection of the jig sensor in a state where the ejection of the processing liquid from the nozzle is prohibited, the controller permits the ejection of the processing liquid from the nozzle.