METHOD FOR FORMING PAD OF WAFER

摘要

The present invention relates to a technology for simply performing a process of forming a pad on the rear surface of a via hole in a packaging process in a process of forming a pad of a wafer. The present invention is characterized by a packaging process in a process for manufacturing a wafer, the packaging process comprising the steps of: attaching glass to the upper portion of a micro lens and then separating a handling wafer from an element wafer, thereby exposing metal layers formed on the element wafer to the outside; and forming pads for the metal layers.