发明名称 |
METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE USING A REMOVABLE COVER LAYER |
摘要 |
<p>A core or sub-composite structure is provided including a dielectric layer between a first conductive film and a second conductive film. The first conductive film may include a first peelable/removable cover layer formed on or coupled to a first conductive layer. The second conductive film may include a second peelable/removable cover layer formed on or coupled to a second conductive layer.</p> |
申请公布号 |
WO2015004541(A2) |
申请公布日期 |
2015.01.15 |
申请号 |
WO2014IB02315 |
申请日期 |
2014.06.23 |
申请人 |
SANMINA CORPORATION |
发明人 |
IKETANI, SHINICHI;KERSTEN, DALE |
分类号 |
H05K3/10 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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