SEMICONDUCTOR PACKAGE AND MOUNTING METHOD

摘要

The present invention relates to a semiconductor package and a mounting method thereof. The external terminal of a semiconductor package can be selectively used by adjusting a gap between the semiconductor package and a PCB for mounting the semiconductor package according to a condition such as a manufacturing process or components for use. The semiconductor package includes a semiconductor device, an electrode pad connected to the semiconductor device, a passivation surrounding the semiconductor device and the electrode pad, and a terminal hole of the passivation which exposes the electrode pad to the outside.