COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: The part built in printed circuit board and manufacturing method thereof improve the durability of the printed circuit board whole by enhancing the adhesive force between the insulating layer and the printing circuit layer. CONSTITUTION: It is formed in at least a part of the mounting an electronic part pad is the printing circuit layer the printing circuit layer is formed on the insulating substrate. The printing circuit layer having no the mounting pad is surface-treated. The electronic component is installed in the mounting pad in the surface with the packaging technology. One or more electronic components is buried to one or more insulating layers(180).