发明名称 LASER LIGHT SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To achieve shorter processing time at a time of processing a substrate using a laser beam.SOLUTION: This substrate processing apparatus is an apparatus processing a substrate by irradiating the substrate with a laser beam, and comprises: a workpiece table 2 on which a processing target substrate is mounted; a laser beam output unit 15 outputting the laser beam; a galvano scanner 19 and a lens unit 20; an optical system 16; and a table moving mechanism 5. The galvano scanner 19 and the lens unit 20 condense the input laser beam onto a plurality of points linearly different in a depth position of the substrate in a predetermined range and repeatedly perform scanning in the predetermined range. The optical system 16 guides the laser beam from the laser beam output unit 15 to the galvano scanner 19.
申请公布号 JP2015006689(A) 申请公布日期 2015.01.15
申请号 JP20130133477 申请日期 2013.06.26
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 SHIMIZU SEIJI;FUKUHARA KENJI;HAYASHI NAOHISA;OKAMOTO HIROKAZU
分类号 B23K26/064;B23K26/08;B23K26/36;C03B33/09 主分类号 B23K26/064
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