发明名称 |
LASER LIGHT SUBSTRATE PROCESSING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To achieve shorter processing time at a time of processing a substrate using a laser beam.SOLUTION: This substrate processing apparatus is an apparatus processing a substrate by irradiating the substrate with a laser beam, and comprises: a workpiece table 2 on which a processing target substrate is mounted; a laser beam output unit 15 outputting the laser beam; a galvano scanner 19 and a lens unit 20; an optical system 16; and a table moving mechanism 5. The galvano scanner 19 and the lens unit 20 condense the input laser beam onto a plurality of points linearly different in a depth position of the substrate in a predetermined range and repeatedly perform scanning in the predetermined range. The optical system 16 guides the laser beam from the laser beam output unit 15 to the galvano scanner 19. |
申请公布号 |
JP2015006689(A) |
申请公布日期 |
2015.01.15 |
申请号 |
JP20130133477 |
申请日期 |
2013.06.26 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD |
发明人 |
SHIMIZU SEIJI;FUKUHARA KENJI;HAYASHI NAOHISA;OKAMOTO HIROKAZU |
分类号 |
B23K26/064;B23K26/08;B23K26/36;C03B33/09 |
主分类号 |
B23K26/064 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|