SEMICONDUCTOR WAFER PROCESSING PROCESS

摘要

PROBLEM TO BE SOLVED: To perform highly-flattening processing of a surface of a semiconductor wafer.SOLUTION: A resin adhering and grinding step is performed repeatedly. The resin adhering and grinding step includes surface-grinding one surface of a wafer obtained by slicing a semiconductor single crystal ingot by using a wire-saw device, by using as a reference surface a flat surface obtained by applying a curable material on the whole surface of the other surface of the wafer, and surface-grinding the other surface of the wafer by using the one surface of the surface-ground wafer as a reference surface.